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Advanced Flip Chip Packaging / Edition 1
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Barnes and Noble
Advanced Flip Chip Packaging / Edition 1
Current price: $219.99
Barnes and Noble
Advanced Flip Chip Packaging / Edition 1
Current price: $219.99
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presents past, present and future advances and trends in areas such as substrate technology, material development, and assembly processes. Flip chip packaging is now in widespread use in computing, communications, consumer and automotive electronics, and the demand for flip chip technology is continuing to grow in order to meet the need for products that offer better performance, are smaller, and are environmentally sustainable.
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